Process Capability
Product type availability..................SMOBC (soldermask over bare copper)Overall electric gold platedPassive CopperChemical gold depositNumber of layers..................2 to 14 layersMaximum panel size..................610mm¡Ñ530mmMinimum panel size..................no limitMinimum inner layer thickness..................0.08mm (0.004 inches)Minimum finished board thickness Double-sided..................0.4mm (0.015 inches) 4 layer..................0.3mm 6 layer..................0.8mm 8 layer..................1.0mm10 layer..................1.6mm12 layer..................1.6mmBoard thickness tolerance..................¡Ó0.127mm (0.0005 inches) ¡Ö10%Minimum line width/spacing..................0.12mm / 0.12mmMinimum SMD pad pitch..................0.3mmMinimum finished hole size 1.6mm (board thickness)..................0.2mm 2.0mm(board thickness)..................0.35mm 2.5mm(board thickness)..................0.40mm 3.2mm(board thickness)..................0.50mmHole location tolerance..................0.025mm dia. True position (0.001 inch)Board flatness tolerance..................5%Outline dimension tolerance..................¡Ó0.127mmRegistration toleranceLayer to Layer..................¡Ó0.127mmSoldermadk..................¡Ó0.127mmFeature to feature..................¡Ó0.127mmElectric test..................250 Volts, 3 Meg ohmsVI.2.1 Purpose
To ensure that all documentation supplied by customer and generated within the company is controlled and maintained within the company in an orderly manner.
VI.2.2 Scope
Documentation control is applied to the following documents as example.
a. System documentation ¡V Quality Manual, Operation Procedures.
b. Engineering documentation ¡V Manufacturing specifications, Standards, Worksheets, Artworks, Drawings, Operation Instructions, ECN and Data file disks.
c. Quality documentation ¡V Inspection plans Test & Inspection records, Quality Procedures, Audit reports.
d. Customer documentation ¡V Purchasing Order, Contracts, Specifications, Drawings, Artworks, Gerber file disks, Program tapes, ECR/ECN.
VI.2.3 Procedures
2.3.1. The company central filing shall keep a complete, updating set of system documentation (the master), each department shall only keeps that documents, procedures which related to the department.
2.3.2. The original copy shall be kept and maintained in each department for those documents if and only if, are used within department.
2.3.3. The master Specification file is located in the Engineering Department Engineering is responsible to ensure that the correct revision is at all times and at all distributions.
2.3.4. One copy of the engineering and sales released documentation (Engineering documentation and customer documentation) is retained on file in the Quality Assurance Department.
2.3.5. The company central filing is responsible for filing, updating and maintaining those International standards (e.g. MIL Standards, UL Standards, ISO Standards, IEN Standards and IPC Standards), National Standards (CNS) and company standards, and ensure all documents in each department are latest version.
2.3.6. Documentation editing, approval, identification, releasing, updating and maintaining shall be in accordance to documentation control procedure.
2.3.7. Edition number shall be assigned for all released documents in accordance with Document coding standards.
2.3.8. The document distribution department is responsible for logging its distribution, a logbook shall be retained and shall include:
a. document title
b. brief description of document
c. issue date
d. distribution list and copies
e. the receiving signature
2.3.9. All documentation are updated us needed or requisite authorities. All engineering change is controlled by the ECO/ECR procedure.
2.3.10. All such documents have an official approval and authorization sequence,and specific distribution allocated. All handing, duplicating and maintaining shall be in accordance document control procedure.
