| PRODUCTION FLOW | INSPE. CRITERIA | INSPE. METHOD | INSPE. QTY |
| Laminate | Pin Hole Ditch | Visual | 5 Sheet / Lot |
| Inner Layer Image | Open / Short Nick First Piece | Visual |
Production: 100% IPQC: 8%--12% |
| Inner Layer Etching | Operating Condition | AOI Electronic Test Visual | Production: 100% |
| Lamination |
Operating Condition Pin Hole Ditch |
Visual |
First Lot IPQC: 8%--12% |
| Drilling |
Extra Hole Missed Drill True Position |
Test Drill Sheet Art-Work Hole INSPE. |
First Drill Batch Production: 100% |
| PTH & Panel Plating | Plating Thickness |
Cross Section Back Light |
3 Time / Day |
| Outer Layer Image | Open / Short Nick | Visual | Production: 100% |
| Outer Layer INSPE. | Open / Short Nick | Visual | IPQC: 8 %--12% |
| Outer Layer Etching | Appearance Line Width | Visual 50X micrometer |
Production: 100% IPQC: 3 Panel / Lot |
| Solder Mask INSPE. | Appearance Solder Thickness Solder Mask blister | Visual 50X micrometer Visual | Production: 100% IPQC: 8%--12% |
| Hot Air Leveling INSPE. | Solder Thickness Solder Mask Blister | X-Ray Visual | First Piece Production: 100% |
| Outline Forming | Dimension | Verifier | QC: 100% |
| Outline INPSE. | Dimension | Verifier Projection Scope | QC: 100% |
| Pattern Sn / Pb Plating | Plating Thickness | Cross Section | 3 Time / Day |
| Open / Short Test | Electronic Test | Universal Tester Dedicated Tester Fly Needle Tester | QC: 100% |
| OQC INSPE. | Appearance Dimension | Visual Verifier | AQL Level 2 0.65 |
| Out-of¡VBox INSPE. | Solder ability Ionic contamination Thermal | Solder Bath Dipping Omega Teste IR. Reflow | 1¡X2 Piece / Lot |
