Manufacture Technology Summary¡@ Max Layer : 14 layers Multi layer Board Thickness : 0.3 mm till 5.0 mm Min. Line Width / Spacing : 0.08mm / 0.08 mm Min. Finished Via hole size : 0.2 mm Aspect Ratio : 8 / 1 Surface Treatment : HASL / Immersion or Gold / Flax Process Impedance control : 5% Min. SMT Pitch : 10 mil Layer to Layer Registration : 3 mil